glas fibre base material with high temperature resistance
direct mounting of power circuits on case
cooling of power component by case
Ceramic Base Material
use of ceramic base material (Al2O3,
AlN)
direct placement of circuits on the base material
very good heat transportation by base material
additional improvement of heat removal by direct placement and
bonding of dies
on base material - reduction of thermal resistance
because chip case is absent
bonding of dies allows closely placement
DBC Hybrid
high current-carrying capacity, on the picture >100A
by circuit board dimensions of 58 x 67 mm for a 3 phase power
amplifier
Thick Film Hybrid
additional reduction of dimension by printed resistors
lower current-carrying capacity in comparison to DBC hybrid
technology
SEMATEC System Engineering & Marine Technology GmbH